• Peek Process Insights Provides Sensing Data for Real-world Conditions

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    One of the biggest challenges for any new product development in the complex semiconductor industry is obtaining sensing data for real-world conditions to use for development. Additionally, getting real-world customer feedback during development can be very difficult. The F450C solves both of those problems.  (more…)
  • Mapping the Geographic Reach of 450mm at SEMICON West

    The above map illustrates F450C and G450C’s SEMICON West presence. Please note that each data point represents attendees’ cities of origin.

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  • Advancing Semiconductor Wafer Manufacturing Technology While Addressing the Continuing Environmental Challenges of Exhaust Gas Abatement

    As our global appetite for all things high-tech increases with the latest mobile devices and gadgets as well as the ever-expanding server/cloud market, the need to produce these devices in higher volume factories along with specialty devices at small-scale facilities lends to new environmental challenges that face the device manufacturing industry. (more…)
  • F450C and G450C Members Meet at SUNY Poly’s Albany Site

    As part of ongoing face-to-face engagement between the F450C and G450C, members of both consortia gathered recently at M+W Group’s headquarters at the State University of New York Polytechnic Institute’s College of Nanoscale Science & Engineering (CNSE), nestled in the emerging technology hub in upstate New York, to discuss the status of facilities infrastructure projects supporting the semiconductor industry’s eventual transition to the 450mm wafer size. (more…)
  • Water Treatment Considerations for 450mm Fabs

    While the F450C addresses many of the larger infrastructure challenges in the transition to 450mm wafer sizes, water treatment systems are affected only minimally. Still, it’s important to consider the impact of this transition, as water treatment is critical to the wafer fabrication processes, especially as we’re simultaneously scaling to smaller nodes. (more…)
  • F450C Hosts Meeting in Albany, NY for Updates on R&D Groups

    Members of the F450 Consortium, along with G450C management, met in mid-November at the beautiful new M+W Group office space in the Zen building at Albany’s SUNY Poly CNSE campus. Nearly all of the F450C member companies were in attendance and served as an opportunity to showcase the fine work being done by our member companies, moving the industry closer to high-volume manufacturing for the 450mm wafer. We engaged in lively conversation about our current priorities, realigned on existing and future priorities, discussed emerging opportunities for expanded collaboration and outlined a roadmap for the next 18 months. (more…)
  • F450C Panel Updates Progress at SEMICON West 2015

    Last Tuesday at SEMICON West, the Facilities 450mm Consortium hosted a panel of representatives from F450C and G450C member companies to provide an update on fab facilities and infrastructure progress in preparing for the transition from 300mm substrates to 450mm. As the F450C Program Manager, I was honored to moderate the panel which included David Skilbred, Director of Program Coordination/Management, G450C (Intel assignee); Ben Peek, F450C Project Architect from Haws; Lothar Till, Managing Director for Ovivo Switzerland; Paul Alers, Head of Product Management for Busch Vacuum; and Joe Guerin, Head of Sales and Marketing for CS CLEAN SYSTEMS. (more…)
  • F450C Members at SEMICON West

    Next week, the semiconductor industry will descend upon San Francisco for the annual SEMICON West, July 14-16 at the Moscone Center. F450C and its members will again be well-represented as both exhibitors and as attendees. We encourage those attending to stop by our members’ booths to explore their latest news and technologies. Below are the booth locations for the exhibiting members. We hope to see you there! Additionally, F450C will be hosting an interactive Q & A style panel, titled “F450C Today: Developing Tomorrow’s Industry Solutions,” on Tuesday, July 14. The panel will consist of F450C and G450C representatives and will run from 3:30 to 4:30 PM at the Impress Lounge (above Moscone North). If you are interested in attending the panel, please email with your information. Please be aware there are a limited number of seats available. Booth locations of F450C member companies:

    Air Liquide Electronics U.S. LP  

    Booth 1205, Moscone South


  • Twin Screw Process Vacuum Pumps Scalable for 450mm

    With SEMICON West just around the corner, F450C member company, Busch Semiconductor Vacuum Group is introducing their latest range of twin-screw, dry-running vacuum pumps, the COBRA BC series. This latest offering from Busch is ideally suited to the demands of the 450mm wafer fab future, but is also applicable to today’s fabs by being backward scalable across all wafer sizes. Busch COBRA technology is based on the proven twin-screw vacuum principal that is suited to providing vacuum for all process environments. The COBRA BC series (ranging from 100–2000 m3/hr) features small footprints that allow for pump stacking. This results in a reduction in expensive sub-fab real estate. Additionally, there are savings to be gained through reductions in power and nitrogen requirements, as well as through optimization of pump idle modes. (more…)
  • Sustainability of Future Fabs with Smart Utilities

    Ben Peek began his career as a research chemist with Texas Instruments, R&D Labs, in the 1960s. His interest was surface chemistry (flat surfaces) and basic research in exotic semiconductor materials such as gallium arsenide (GaAs), germanium, indium phosphide (InP), indium antimonide (InSb), and mercury cadmium telluride (HgCdTe). These materials are today’s mainstays for speed and for building sensors. After the research role, Peek began operating pilot production lines in TI’s early product portfolios for microwave devices, digital signal processing components and integrated circuits. (more…)
  • Hidden Costs of Toxic Gas Abatement

    In transitioning from 300mm to 450mm wafer processing, the surface area of each wafer approximately doubles and so the mass of direct materials used in deposition and etch chambers can be expected to increase accordingly. Consequently, the cost to deliver and abate process chemicals will likewise double…unless we re-examine how our process tools are integrated into our fab facilities. The abatement of toxic effluent gases from deposition and etch chambers is an ongoing challenge for fabs, and there are different “optimal” solutions depending on whether we take a unit-process or a total-fab perspective. (more…)
  • 450mm: Challenges to Process Optimization and Yield

    For at least the last 30 years, minimum features of devices have decreased, and the cost per transistor has also decreased. Several IC makers have indicated that below the 20nm node, the cost per transistor is now anticipated to increase. Certainly, one driver of 450mm wafer transition is the anticipated decline in the cost to process wafers. The larger wafer size has an area 2.25X larger than the 300mm wafers, and fabs expect the 450mm equipment to be only ~1.5x the 300mm equipment. The fabs also hope the materials used for 450mm wafers will be less than 2.25X, thereby, reducing the cost to produce quality devices.