On the first day of SEMICON West 2015, the Facilities 450mm Consortium hosted a panel of representatives from F450C and G450C member companies to provide an update on fab facilities and infrastructure progress in preparing for the transition from 300mm substrates to 450mm. The interactive panel entitled, “F450C Today: Developing Tomorrow’s Industry Solutions,” was moderated by F450C Program Manager Todd Fosler, and consisted of five panelists: David Skilbred, Director of Program Coordination/Management, G450C (Intel assignee); Ben Peek, F450C Project Architect from Haws Corp.; Lothar Till, Managing Director for Ovivo Switzerland; Paul Alers, Head of Product Management for Busch Vacuum; and Joe Guerin, Head of Sales and Marketing for CS CLEAN SYSTEMS.
The panel’s timing was advantageous, as it came less than one week after Nikon and SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE, home of both F450C & G450C) had announced the world’s first ever 450mm immersion scanner, the Nikon NSR-S650D, having been installed and is transitioning to wafer patterning in Albany.
As the panel progressed, two dominant themes emerged: access to manufacturing information and manufacturing sustainability and resource conservation. David Skilbred directly addressed the industry’s question: what’s the outlook for 450mm and where does the value of G450C/F450C fall? He noted that while the 450mm roadmap has seen some delays, there is still great value in investing in R&D for this technology, much of which can be applicable to today’s technology.
In regards to the former theme of access to information, Ben Peek spoke to efforts by Haws, M+W, and G450C to build remote tool monitoring capabilities into the Albany research fab, thus providing an industry-first ability to remotely assess manufacturing resource usage and manufacturing process anomalies via a secure, Internet network. Next, Lothar Till and Paul Alers talked about the efforts by Ovivo and Busch to address the needs for resource conservation and environmental mitigation in areas such as power usage, water consumption, and waste stream management, both in today’s state-of-the-art 300mm facilities as well as the upcoming 450mm facilities. Joe Guerin spoke to the different factors that come into play when choosing an abatement system, stressing the need to strike a balance for each process technology and wafer size.
Collectively, the panelists’ remarks reflected an overall spirit of collaboration that is essential in the F450C and G450C efforts, aimed at sharing information and ultimately reducing the industry’s costs associated with the next wafer size transition.
Below are selected pictures to highlight the event.
F450C Hosts Panel During SEMICON West 2013