What is the Global 450 Consortium (G450C) Program?

The G450C is focused on building the 450mm wafer and equipment development environment. The consortium, made up of of 5 member companies (Intel, TSMC, GLOBALFOUNDRIES, IBM, Samsung) and New York State partnering with the College of Nanoscale Science and Engineering (SUNY Poly’s Albany site) of the University at Albany, State University of New York is:

  • a New York based consortium.
  • built on the base program started under ISMI’s R450 Program.
  • funded to collaboratively work with suppliers to develop 450mm equipment.
  • using wafers, equipment, people and cleanroom space to develop and test equipment to meet industry needs.


The vision of the G450C is to be a public-private partnership program (New York State (SUNY Poly’s Albany site), Intel, TSMC, Samsung, IBM and GLOBALFOUNDRIES) that develops cost-effective test wafer fabrication infrastructure, equipment prototypes and high-volume tools to enable a coordinated industry transition to 450mm wafers. The program will use the capabilities established at SUNY Poly’s Albany site for joint development activities and support of a comprehensive industry ecosystem.




The objectives of the G450C are:

  • to assure a smooth and coordinated 450mm wafer transition;
  • expand test wafer operations to accelerate and support supplier development;
  • support tool demonstrations;
  • demonstrate a full 450mm fab tool set;
  • continued 450mm research and development after the completion of equipment demonstrations;
  • enable innovation, but not slow scaling;
  • enable OEMs and tool makers to transition to 450mm in a highly coordinated fashion under a financially (New York) leveraged business strategy; and work with suppliers and other associations/consortia to develop standards and support the development of common equipment building blocks.